Surface Analysis of Chamber Coating Materials Exposed to CF4/O2 Plasma

نویسندگان

چکیده

Coating the inner surfaces of high-powered plasma processing equipment has become crucial for reducing maintenance costs, process drift, and contaminants. The conventionally preferred alumina (Al2O3) coating been replaced with yttria (Y2O3) due to long-standing endurance achieved by fluorine-based etching; however, continuous increase in radio frequency (RF) power necessitates use alternative materials reduce shift a series semiconductor manufacturing environments. In this study, we investigated etching resistance atmospheric pressure-sprayed alumina, yttria, yttrium aluminum garnet (YAG), oxyfluoride (YOF). prepared ceramic-coated samples were directly exposed silicon oxide etching, plasma-exposed characterized scanning electron microscopy, energy-dispersive X-ray spectroscopy, photoelectron spectroscopy. We found that an ideal material must demonstrate high plasma-induced structure distortion fluorine atom from radical. For exposure, bonding fluoride was shown be more effective than oxide-based ceramics. Thus, fluoride-based ceramic can promising candidates chamber materials.

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ژورنال

عنوان ژورنال: Coatings

سال: 2021

ISSN: ['2079-6412']

DOI: https://doi.org/10.3390/coatings11010105